NEW Bench Top IR heating BGA rework station for XBOX Laptop

The list of articles:

l         A BGA rework station

l         A manual

Performance:

• This station can be used for the repairing of the large circuit board such as mainboards of computer, game machine, communications equipment, and so on.

• The machine can be used to do the drying of the circuit board.

• The infrared heating is used for this machine

• The lower part of this machine is the preheating station which is used for the preheating of the PCB boards to ensure that the PCB board is not deformed.

Parameters:

• Dimensions: length 410mm × width 400mm × high 320mm

• Power supply: 220-230V 50/60HZ.

• Power rate: 2600W.

• Weight: 18 kilograms.

The welding success rate of this machine can almost achieve 100%, if the using results did not achieve this goal, please contact with the customer service, to find the root of the problem in time.

 Adiabatic of the preheating station

l        In most cases, the sizes of the preheating station will larger than that of the circuit board, which will lead to that some pre-heating body of the station exposed.

l        In order to ensure the success rate, the blank of the pre-heating body can be covered with cardboard.

Warranty Regulations

l        Since the date of purchase, we are responsible to replace this product in one year, after one year, the repair parts and materials will be charged.

l        The modifications on the product structure, circuit by users are not include in the scope of the warranty.

l        In the warranty period, if there is the problem in the quality of the product itself, we will replace the parts or repair free of charge, but the transportation fee will be charged.

l        For the circumstances cause by the fault of users, such as operation error, self-changing the internal structure, the product will not be exchanged.

l        The device is not waterproof, it is strictly prohibited to be watered.

l        The normal operating voltage of the machine is 220-230V; please do not use incorret power supply.

l        In using this equipment, please first ensure the effective grounding to prevent power leakage.

l        In the operation of this equipment, the pre-heating station and heating head are at a high temperature, do not contact these sites with the skin to prevent scalding.

Disclaimer:

l        Before skillfully master this machine, please first use the useless circuit board to practice the operation process of the machine. Otherwise, the operation of the machine is seen as use improperly, the resulting loss will be commitment by the user alone.

l        Because of the different working conditions, the heating temperature setting parameters will be changed a few, please debug regularly, the temperature parameters will based on the result of debugging.

Temperature settings data

( lead  solder  ball )

Pre-heating temperature：190

Upper heating temperature：190

Time：120 seconds

Temperature settings data

( lead-free  solder  ball )

Pre-heating temperature：225

Upper heating temperature：225

Time：120 seconds

PCB board drying

Pre-heating temperature：100

Upper heating temperature：100

Time: 1 hour

Planting solder ball

Pre-heating temperature: none

Upper heating temperature: 260

Time: 180 seconds

Welding  knowledge:

l         There are two commonly used solder ball, one is solder with lead, the other is lead-free solder.  The melting point of the majority of lead solder is 183 degrees, while that of lead-free solder is 217 degrees.

l         PCB boards not having done drying should not be rapidly heated, otherwise, PCB board or BGA chip may be damaged. Damage is mainly presented in bubble, burst, and sometimes a little sound may be heard.

l         The temperature sensor of LK-F3 has not directly contact with circuit board and it is designed to detect the air temperature around the circuit board, and the value that thermometer shows is not the actual temperature of the circuit board.

l         Some electrolytic capacitors, plastic socket, plastic socket can not bear high temperature. In order to prevent its being baked in high-temperature, please paste the insulation film on the surface.

l         The residual solder on the pad should be erased with good performance iron, and it should be finished carefully to avoid knock_off the PCB board pad.

l         PCB board after removed solder should be cleaned, and the pad should be bright on its surface, otherwise, they might not stick the solder.

l         Circuit board after soldering should be cooled to room temperature before testing.

l         Too long time heating may cause discoloration of circuit board.

l         After the surrounding area of BGA chips is pasted with heat-proof tape, the heat transfer may be affected; resulting in un-melted solder after the process. By extending the heating time, this problem can be solved.

l         Solder melting around 20 seconds before the end of the work process is appropriate. If the solder melting time is too long in advance, it is suggested to reduce the temperature appropriately to prevent heat damage or even chip welding. If the time of molten solder in advance is too short, it is suggested to increase the temperature appropriately to prevent non-welding.

shipping

The price of this article has already included the shipping fee of DHL/UPS/FEDEX/EMS to west Europe( UK ,France, Germany, Italy etc.), to North America(USA,Canada) and to Australia,New Zealand  ,The countries and areas that are not listed above, please enquire us by email. This shipping service takes 5 -7 working days.

 Warranty : one year limited on all electronic